Symposium CC
Joining of Ceramic Materials: Scalable, Reliable, and Sustainable Solutions
Convener:
Milena SALVO, Politecnico di Torino, Italy
Members:
Jian CAO, Harbin Institute of Technology, China
Valerie CHAUMAT, CEA, France
Monica FERRARIS, Politecnico di Torino, Italy
Masahiro FUKUMOTO, Toyohashi University of Technology, Japan
Marion HERRMANN, Technische Universitaet Dresden, Germany
Fiqiri HODAJ, Grenoble Institute of Technology, France
Kevin M. KNOWLES, University of Cambridge, UK
Takaaki KOYANAGI, ORNL, USA
Ivar E. REIMANIS, Colorado School of Mines, USA
Noritaka SAITO, Kyushu University, Japan
Stefan SCHAFFOENER, Bayreuth University, Germany
Alexander SHAPIRO, Ohio State University, USA
Fabrizio VALENZA, ICMATE-CNR, Italy
Milena SALVO, Politecnico di Torino, Italy
Members:
Jian CAO, Harbin Institute of Technology, China
Valerie CHAUMAT, CEA, France
Monica FERRARIS, Politecnico di Torino, Italy
Masahiro FUKUMOTO, Toyohashi University of Technology, Japan
Marion HERRMANN, Technische Universitaet Dresden, Germany
Fiqiri HODAJ, Grenoble Institute of Technology, France
Kevin M. KNOWLES, University of Cambridge, UK
Takaaki KOYANAGI, ORNL, USA
Ivar E. REIMANIS, Colorado School of Mines, USA
Noritaka SAITO, Kyushu University, Japan
Stefan SCHAFFOENER, Bayreuth University, Germany
Alexander SHAPIRO, Ohio State University, USA
Fabrizio VALENZA, ICMATE-CNR, Italy
The list of Invited Speakers will be available at the end of July 2025
As deep-tech innovations drive the development of novel materials and manufacturing processes, new approaches to inorganic materials joining and integration are emerging. The demand for advanced joining solutions for ceramics, glasses, and their composites continues to grow, fueled by cutting-edge applications such as advanced microelectronics, next-generation energy systems, biomedical implants, space exploration, and more. These fields require engineered joining solutions that harness the unique properties of ceramic materials while ensuring structural integrity and functionality in complex final components.
One of the key challenges in this field is the joining of materials with inherently different chemical, thermal, and mechanical behaviors. Achieving robust and durable dissimilar joints necessitates a deep understanding and control of materials interactions across multiple length scales, from nanoscale to macroscopic assemblies. Surface functionalization, interfacial reactions, and advanced or unconventional joining techniques play a critical role in optimizing performance and reliability.
Building on the success of previous CIMTEC symposia, this symposium will serve as a dynamic forum for researchers, engineers, and industry experts to discuss the latest advancements, share insights, and explore future directions in ceramics joining and integration.
Topics will cover modeling, processing, characterization, and testing across multiple scales—from nano- and microscale to macroscale—addressing a range of technology readiness levels. Key Topics Include:
One of the key challenges in this field is the joining of materials with inherently different chemical, thermal, and mechanical behaviors. Achieving robust and durable dissimilar joints necessitates a deep understanding and control of materials interactions across multiple length scales, from nanoscale to macroscopic assemblies. Surface functionalization, interfacial reactions, and advanced or unconventional joining techniques play a critical role in optimizing performance and reliability.
Building on the success of previous CIMTEC symposia, this symposium will serve as a dynamic forum for researchers, engineers, and industry experts to discuss the latest advancements, share insights, and explore future directions in ceramics joining and integration.
Topics will cover modeling, processing, characterization, and testing across multiple scales—from nano- and microscale to macroscale—addressing a range of technology readiness levels. Key Topics Include:
- Surface and interface science: wetting phenomena, diffusion mechanisms, and interfacial reactions
- Innovative joining techniques: nano-bonding, transient liquid phase bonding, laser joining, rapid heat-source methods, and more
- Characterization and reliability assessment
- Computational modeling and simulation: from atomic-scale interface modeling to macroscopic joint design and performance prediction
Session Topics
CC-1 Interface science for integration of inorganic materials
- Thermodynamics and kinetics of interface formation
- Mechanisms of wetting and adhesion
- Characterization and control of interfaces for high-performance joints
CC-2 Innovations in joining methods and materials
- Challenges and solutions in joining similar and dissimilar materials
- Joint performance: strength, thermal/chemical stability, and reliability
- Modeling, design, and characterization of joined components
- Joining and integration challenges across macro-, micro- and nanoscales
- Joining techniques for MEMS, microelectronics, and packaging
- Applications in space, automotive, energy, biomedical, and other high-tech industries
- Sustainable joining techniques