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IC-1.C

  • Solidification processing, extrusion, rolling, electrodeposition, etc.
  • Reaction bonding, diffusion bonding, chemical vapour infiltration, melt infiltration, sintering, hot pressing, HIPing, spark plasma sintering, colloidal processing, etc.
  • Net shape processes, computer-aided component design and fabrication, rapid prototyping, process modelling.
  • Additive manufacturing technologies
  • Green and eco-friendly processing and manufacturing technologies
  • Joining, attachment, machining, and repair technologies

Cimtec 2026

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