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Symposium FH
Thermoelectrics: Materials Research and Application Technologies

MONDAY    JUNE  22    AFTERNOON

Room:    SALA STAMPA


Chair:     Lidong CHEN, China (Convener)

14.25     Welcome

Session FH-1 Thermoelectric materials research & characterization

14.30     FH-1:IL01  Transverse Thermoelectrics
K. UCHIDA, National Institute for Materials Science, Tsukuba, Japan; The University of Tokyo, Kashiwa, Japan

15.00     FH-1:IL02  Discovery and Development of Half-Heusler Thermoelectric Materials
CHENGUANG FU, TIEJUN ZHU, Zhejiang University, Hangzhou, China

15.30     FH-1:IL03  New Directions in Half-Heusler Thermoelectric Materials
J.-W.G. BOS, EaStCHEM School of Chemistry, University of St Andrews, North Haugh, St Andrews, UK

16.00     Break


Chair:     Ken-ichi UCHIDA, Japan

16.30     FH-1:IL04  Development of High-efficiency Thermoelectric Materials Utilizing Magnetism
TAKAO MORI, National Institute for Materials Science (NIMS), Tsukuba, Japan

17.00     FH-1:IL05  Ceramic Thermoelectrics: Bridging Design and Performance
A.V. KOVALEVSKY, D. LOPES, P. AMIRKHIZI, M.A. VIEIRA, S. RASEKH, A.A. YAREMCHENKO, CICECO – Aveiro Institute of Materials, Department of Materials and Ceramic Engineering, University of Aveiro, Aveiro, Portugal; N.M. FERREIRA, F.M. COSTA, i3N, Physics Department, University of Aveiro, Aveiro, Portugal; WENJIE XIE, A. WEIDENKAFF, Materials and Resources, Techn. Universität Darmstadt, Darmstadt, Germany; E. GUILMEAU, G. RIOU, Laboratoire CRISMAT, UMR 6508, CNRS, ENSICAEN, Caen Cedex, France; A. SOTELO, INMA, CSIC-Universidad de Zaragoza, Zaragoza, Spain

17.30     FH-1:IL06  Designing Thermoelectrics by Tailoring Chemical Bonds
M. WUTTIG1,2, YUAN YU1, 1Institute of Physics IA, RWTH Aachen University, Aachen, Germany; 2Peter-Grünberg-Institute (PGI 10), Forschungszentrum Jülich, Jülich, Germany


TUESDAY    JUNE  23    AFTERNOON

Room:    SALA STAMPA

Chair:     Matthias WUTTIG, Germany

Session FH-1 Thermoelectric materials research & characterization

15.00     FH-1:IL07  Revisiting Cu in Bi2Te3 Based Compounds
WENJIE XIE, Institute of Materials Science, Technical University of Darmstadt, Darmstadt, Germany

15.30     FH-1:IL09  Enhanced Thermoelectric Performance of SrTiO3 with Metallic Nanoparticles Exsolved under Reducing Conditions
MICHITAKA OHTAKI, RYUSEI MAEDA, LEO AOKI, KOICHIRO SUEKUNI, Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Japan

16.00     FH-1:L11  Metallurgical Processing of Intermetallic Compounds for Thermoelectric Waste Heat Harvesting
A. CASTELLERO, X. HUANG, E. BERARDINO, M. BARICCO, Università di Torino, Dipartimento di Chimica, NIS, INSTM, Turin, Italy; C. FANCIULLI, CNR - ICMATE, Lecco, Italy; A. FERRARIO, S. BOLDRINI, CNR - ICMATE, Padova, Italy


WEDNESDAY    JUNE  24    MORNING

Room:    SALA STAMPA


Chair:     Takao MORI, Japan

Session FH-2 Device research and modelling

  9.00     FH-2:IL16  Thermionic-Thermoelectric Generators in Sensible Heat Thermal Batteries
A. BELLUCCI, CNR-ISM - Istituto di Struttura della Materia del Consiglio Nazionale delle Ricerche, Monterotondo scalo (RM), Italy

  9.30     FH-2:IL17  Development of Heat Flux Sensor Using Anomalous Nernst Effect: New Materials and Applications
YUYA SAKURABA, WEINAN ZHOU, NIMS, Tsukuba, Japan; YUTARO TABATA, SYUJI INAMURA, MANABU ORITO, KATSUHISA TAGUCHI, SEMITEC

10.00     FH-2:IL19  Micro-Thermoelectric Devices
H. REITH1, N.B. PULUMATI1,2, A. SUNDAR1,2, K. NIELSCH1,2, 1Institute for Metallic Materials, Leibniz Institute of Solid State and Materials Research, Dresden, Germany; 2TU Dresden, Faculty of Mechanical Engineering, Dresden, Germany

10.30     Break


Chair:     Lidong CHEN, China

Session FH-3 Converter technologies and applications

11.00     FH-3:L20  Personalized Thermal Management via Thermoelectric and Textile Heat Exchange Systems
G. LATRONICO, C. FANCIULLI, F. LAZZARI, CNR-ICMATE, Lecco, Italy; G. ROLLO, I. IMPROTA, M. FIUME, M. LAVORGNA, CNR-IPCB, Portici, NA, Italy; S. DEL FERRARO, V. MOLINARO, INAIL-DiMEILA, Monte Porzio Catone, RM, Italy

11.20     FH-3:IL21  Supply-chain, where the Challenge of Commercialization Starts
HAO YIN, TEGnology, Søborg, Denmark

11.50     FH-3:IL22  GemaTEG Ecosystem for Thermal Management of HPC and AI Chips
B. LORENZI, G. CORBUCCI, GemaTEG Italia srl, Perugia, Italy; M. MIOZZA, GemaTEG Inc.

12.20     FH-3:IL23  Durable and Sustainable Thermoelectric Devices made from Magnetsium-antimony Alloys
K. NIELSCH, PINGJUN YING, A. BAHRAMI, RAN HE, Leibniz Institute of Solid States and Materials Research, Dresden, Germany; Institute of Materials Research, Technical University of Dresden, Germany
 

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